EMTensor develops electromagnetic (microwave) tomography systems for brain imaging — scanners that detect and monitor stroke at the bedside and in the ambulance. We are headquartered in Vienna, Austria, with an engineering office in Bengaluru, India. The team is small, so the engineer who designs something owns it end to end.
You own PCB layout for our instrument hardware: an eight-layer mixed-signal board carrying an analogue front end, an RF chain around 1 GHz and a data-conversion stage. You take the board from placement to a released fabrication package, and you stay with it through the first build.
You work directly with the schematic engineer, the FPGA engineer and the system architect. There is no layer of project management between you and the design decisions.
Placement, stack-up and material selection to meet impedance targets on an eight-layer board.
RF routing: impedance-controlled traces, matching networks, ground pours and return paths, shielding, connector transitions.
High-speed routing: differential pairs, length and topology matching, reference continuity, EMC.
A demanding drill specification — 1,060 holes of Ø0.15 mm through 1.61 mm, an aspect ratio of 10.7:1. You will discuss this with the fabricator and decide what is buildable.
Gerbers, drill data, DFM and DFA checks, answering fabricator queries, first-article acceptance.
Feeding layout constraints back into the schematic — telling us early when a part choice will not route.
Eight or more years of board-level PCB layout.
Real RF layout experience — boards where the RF section was yours. This is the requirement we will not compromise on. Antenna ports, RF traces, matching, shielding: we will ask you what you routed and how you verified it.
Altium Designer. If your main tool has been Allegro, Xpedition, PADS or OrCAD, tell us — we will ask how quickly you can switch, and a good answer is enough.
Stack-up, controlled impedance, microstrip and coplanar waveguide, differential pairs, via strategy.
Fluency with the manufacturing package: Gerbers, drill files, DFM, and working with fabricators and assemblers.
Signal- and power-integrity simulation (HyperLynx or equivalent), IR-drop analysis.
IPC-CID or CID+ certification.
A background in radar, instrumentation, scientific equipment, defence, space or wireless products.
Experience mentoring or leading other layout engineers.
This is board-level PCB layout. It is not IC, analogue or mask layout — if your work has been inside the chip rather than on the board, this is not the right role. Schematic design is handled by a separate engineer on the same team; we are hiring for that position in parallel.
Send your CV to [email protected]. Please put the role title in the subject line.
We read every application ourselves and reply to each one. If your CV lists tools without projects, add a few lines about one board you worked on — that is what we look at first.
