#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Senior Staff Engineer Chip Package Board - CoDesign Flow and Methodology on our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?
Your Role
Key responsibilities in your new role
-
Define and drive the technical roadmap for Chip-Package-Board (CPB) design methodologies, flows, tools, and digital engineering capabilities. Partner closely with Business Lines, Design Centers, and engineering communities to understand current and future product requirements, technology trends, and business challenges
-
Translate Business Line needs into methodology enhancements, design-flow improvements, simulation capabilities, automation concepts, and EDA roadmap requirements. Act as the technical bridge between Business Lines, methodology teams, software teams, IT organizations, and EDA vendors
-
Drive continuous improvement of CPB methodologies and engineering workflows to accelerate design convergence, improve design quality, and increase first-pass success. Establish scalable, reusable, and sustainable methodology solutions, standards, and governance models across the CPB ecosystem
-
Identify and shape future capabilities required for advanced packaging, heterogeneous integration, System-in-Package (SiP), 3D design methodologies, multi-domain simulation, and AI-assisted engineering workflows. Evaluate and influence EDA vendor technologies and industry trends to ensure alignment with Infineon's future business needs
- Lead AI, automation, data, and digitalization initiatives that deliver measurable engineering and business value. Drive the evolution towards an integrated, data-driven, AI-enabled, and highly automated CPB co-design environment
- Provide technical leadership, consulting, training, and enablement for global user communities and stakeholders. Build strong partnerships across engineering functions and drive adoption of methodology and digital engineering solutions
Your Profile
Qualifications and skills to help you succeed
-
Degree in Electrical Engineering, Microelectronics, Physics, Computer Engineering, or a related technical discipline, with a minimum of 8 years of experience in semiconductor development, design methodologies, EDA environments, package development, design automation, simulation, or related engineering fields
-
Strong understanding of semiconductor product development, including chip, package, board, simulation, and system-level interactions. Ability to understand Business Line challenges, technology roadmaps, and future product requirements, and translate them into methodology strategies, flow enhancements, and technical development roadmaps
-
Proven experience in defining, optimizing, and deploying engineering methodologies and design flows. Strong analytical and strategic thinking skills, with the ability to identify future requirements and drive technology evolution beyond day-to-day operational support
-
Experience working with EDA technologies and vendors (e.g., Cadence, Synopsys, Keysight, Comsol). Good understanding of digitalization, automation, AI-enabled engineering workflows, and data-driven engineering concepts. Software development experience is beneficial but not the primary focus of the role
-
Strong customer-oriented mindset with the ability to balance operational excellence with long-term methodology, technology, and business strategy
-
Proven track record of leading cross-functional initiatives involving Business Lines, methodology teams, software organizations, IT functions, and external partners. Excellent communication, stakeholder management, and influencing skills with the ability to align diverse teams around a common technical vision
-
Ability to act as a trusted technical partner for Business Lines, combining deep engineering understanding with strong business awareness and a passion for enabling future product innovation
-
Fluent English skills are required; German language skills are considered a strong advantage
The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group H (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/). The monthly salary is paid 14 times p.a. We offer a higher compensation depending on your expertise and skills.
Contact:
Maria Pollai-Schlintl, LinkedIn
#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.
We look forward to receiving your resume, even if you do not entirely meet all the requirements of the job posting.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Click here for more information about Diversity & Inclusion at Infineon.
