15 beste Stellen als layout engineer in graz st – aktuell auf Personalsuche

IC Package / PCB Layout Engineer (d/m/f)
ams-OSRAM AG —Unterpremstätten, ST
- Vollzeit
- Master
- Bachelor
Direkt bewerben
4 Tage
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Anton Paar GmbH —Graz, ST
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Internship - Product Application Engineer (f/m/div)
Infineon Technologies AG —Graz, ST
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Staff Engineer - 3D Integration (d/m/w)
ams-OSRAM AG —Unterpremstätten, ST
- Vollzeit
- Doktorat
Direkt bewerben
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Senior Electronics Engineer Embedded Systems (m/f/x)
go-e GmbH —Graz, ST
- Master
- Bachelor
Direkt bewerben
Principal Physical Verification Engineer (d/m/f)
ams-OSRAM AG —Unterpremstätten, ST
- Vollzeit
- Master
- Bachelor
Direkt bewerben
Embedded Security Engineer / Vulnerability Researcher (Embedded Systems) (m/f/d)
NXP Semiconductors —Gratkorn, ST
- Vollzeit
Software Security Analyst (m/f/d)
NXP Semiconductors —Gratkorn, ST
- Vollzeit
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IC Package / PCB Layout Engineer (d/m/w)
ams-OSRAM AG —Unterpremstätten, ST
- Vollzeit
Direkt bewerben
4 Tage
Production Engineer (m/w/d)
Samsung SDI Battery Systems GmbH —Kalsdorf bei Graz, ST
- Vollzeit
Principal Device Engineer (d/m/f)
ams-OSRAM AG —Unterpremstätten, ST
- Vollzeit
- Master
Direkt bewerben
7 Tage
Principal Physical Verification Engineer (d/m/w)
ams-OSRAM AG —Unterpremstätten, ST
- Vollzeit
Direkt bewerben
Mechanical Engineer (m/w/d)
KNAPP AG —Hart bei Graz, ST
- Vollzeit
Senior Embedded Security Vulnerability Analyst (m/f/d)
NXP Semiconductors —Gratkorn, ST
- Vollzeit
- Master
Principal Embedded Security Vulnerability Analyst (m/f/d)
NXP Semiconductors —Gratkorn, ST
- Vollzeit
- Master

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layout engineer jobs near graz st

IC Package / PCB Layout Engineer (d/m/f)

ams-OSRAM AG
Unterpremstätten, ST

Direkt bewerben

Details zur Stelle

Vollzeit
vor 4 Tagen

Qualifikationen

Master
Bachelor

Vollständige Stellenbeschreibung

Sense the power of light

The ams OSRAM Group is a global leader in innovative light and sensor solutions. With more than 110 years of industry experience, we combine engineering excellence and global manufacturing with a passion for cutting-edge innovation enabling transformative advancements in the automotive, industrial, medical, and consumer industries. “Sense the power of light” – our success is based on the deep understanding of the potential of light and distinct portfolio of emitter and sensor technologies. Around 19,700 employees worldwide drive innovations alongside societal megatrends.
Find out more about us on https://ams-osram.com

Your new responsibilities

Design and develop RF and high-frequency IC substrate and PCB layouts for sensor, and mixed-signal applications, ensuring compliance with electrical, thermal, and manufacturing requirements
Perform RF-aware component placement and transmission line routing, including controlled impedance structures, differential pairs, coplanar waveguides (CPW), microstrip, and stripline implementations
Optimize layout for signal integrity (SI), power integrity (PI), and RF performance, minimizing coupling, crosstalk, insertion loss, return loss, and electromagnetic interference (EMI)
Create and maintain package substrate and PCB layouts using Cadence Allegro Suite (Allegro X, APD), Altium Designer and/or Siemens PADS including design libraries, stack-ups, and constraint management
Collaborate with EMC, analog, package, and IC design engineers to support chip-package-board co-design and ensure successful integration of high-frequency circuits and support for simulation activities using SI/PI/EM extraction tools
Perform design verification and manufacturability reviews, including DRC/ERC checks, fabrication rule compliance
Supplier selection and qualification for PCB and SMT (surface mount technology), including supply chain and assembly support

Who we are looking for

Bachelor's or Master's Degree in Electrical Engineering, Microelectronics, Semiconductor Physics, Computer Engineering, or a related field
Minimum of 6 years experience in Semiconductor/Electronic Industry
Strong experience with Cadence Allegro Suite (Allegro X, APD, Package Designer) and/or Altium Designer
Experience with Cadence Virtuoso Suite and Physical Verification Tools such as Siemens Calibre/Candence PVS of is highly desirable
Knowledge of semiconductor processes, analog/mixed-signal design considerations, and ESD/EMC concepts is considered a strong benefit
Knowledge of controlled impedance routing, electromagnetic coupling, grounding strategies, shielding concepts, and RF matching networks
Experience with IC package substrates, HDI PCB technologies, BGA, wirebond, and flip-chip packaging
CMOS IC layout experience is highly desirable, providing valuable expertise in parasitic control, matching techniques, device placement, shielding concepts, and chip-package-board co-design
Good technical English is a must, German is beneficial

We offer competitive salaries and additional benefits based on your performance, experience and qualification.
The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/).
We offer a higher compensation depending on your expertise and skills.

Please contact Hana Krsul for further information via [email protected] or +43 664 9665611.

Direkt bewerben

Erweiterte Suche

layout engineer Jobs in graz st

IC Package / PCB Layout Engineer (d/m/f)

Hardware Design Engineer (m/w/d) – Globale Produktentwicklung mit Expat-Perspektive

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Staff Engineer - 3D Integration (d/m/w)

Senior Electronics Engineer Embedded Systems (m/f/x)

Principal Physical Verification Engineer (d/m/f)

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IC Package / PCB Layout Engineer (d/m/w)

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Principal Device Engineer (d/m/f)

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Principal Embedded Security Vulnerability Analyst (m/f/d)

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